APAC Lead, Thermal-Mechanical Engineering

We are building Physics AI for hardware design. Our software platform helps hardware designers and physics simulation engineers explore, analyze, and optimize hardware systems, leveraging cutting‑edge AI to deliver ultrafast, accurate physics intelligence within the realities of engineering design workflows.

By bridging the gap between traditional simulation and machine learning, we are redefining how the world’s most advanced semiconductors are designed, verified, built, brought to market and integrated in complex systems.

As part of the Forward Deployment team in Asia Pacific , you will play a pivotal role in driving the adoption of Vinci’s platform among leading engineering organizations. This is a high‑impact leadership position where you will build, mentor, and lead a team of thermal and thermo‑mechanical engineers focused on engaging prospective customers and demonstrating the transformative value of Vinci’s softwar...