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Design Engineering Intern

Qorvo • Osaka, Osaka, Japan • Posted June 03, 2026

Location Osaka, Osaka
Job Type Temp (Payroll)
Category Engineers
Posted June 03, 2026

Responsibilities

:
  • Producing and implementing designs to meet customer specifications for:

  • Low cost and thermally efficient package platforms

  • LTE, carrier aggregation, multiple antennas, filters, and power management

  • Ruggedness, ESD, and quality

  • Meeting performance requirements while also considering size, cost, footprint, and schedule

  • Working with signal generators, spectrum analyzers, network analyzers, and power meters to compare simulated data to real lab data

  • Partnering with technicians to perform circuit simulations and testing as needed

  • Designing, testing, and tuning of RF PAs

  • Developing and executing test plans for electronics package mechanical robustness

  • Developing application guidelines for package assembly into next level assembly

  • Creating basic algorithms for automating FEA model generation

  • Potential to work with:

  • Sig...

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