Director, Package Quality and Reliability

Micron Technology, Inc • singapore, singapore, Singapore • Posted June 27, 2026

Location singapore, singapore
Job Type Full-time
Category Other-General
Posted June 27, 2026
Job Summary

The Director, Package Quality & Reliability Engineering leads the execution and continuous improvement of package reliability, qualification, and failure analysis across new product introductions (NPI) and high-volume manufacturing (HVM). This role is responsible for ensuring robust package quality and reliability performance, identifying and mitigating key risks, and enabling successful product ramps across diverse application segments including mobile, automotive, data center, and AI/HPC.

Main Responsibilities
  • Package Quality & Reliability Engineering
    • Lead execution of package reliability qualification for new product introductions and ongoing reliability monitoring in high-volume manufacturing
    • Identify and resolve key reliability risks, including chip-to-package interaction (CPI), interconnect reliability, thermo‑mechanical stress, and material‑related failure mechanisms
    • Drive improvements in reliability test ...

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