Engineer (Plating/ Wet Process)

UTAC • Singapore, Singapore, Singapore • Posted May 31, 2026

Location Singapore, Singapore
Job Type Full-time
Category other-general
Posted May 31, 2026

Responsibilities:


Plating Process Engineering

  • Develop, implement, and optimize electroplating processes (e.g., Cu, Ni, SnAg, etc.)
  • Monitor plating bath performance through regular analysis and corrective actions
  • Perform DOE, capability studies, and process qualification for new plating chemistry or equipment
  • Lead troubleshooting activities for plating defects such as voids, roughness, nodule formation, non-uniformity, and poor adhesion
  • Establish and maintain plating process parameters, SOPs, and control plans


Wet Process Support (Etching, Cleaning, Stripping)

  • Support wet etching processes (acid, alkaline, micro-etch) and ensure etch rate stability and uniformity
  • Optimize surface preparation steps prior to plating such as micro-etch, oxide removal, and plasma/aquatic cleaning
  • Monitor and sustain wet chemistry tanks (etchants,...

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