Engineer, Staff/Manager (Wet Etch / Electroplating)

Qualcomm • Singapore, Singapore, Singapore • Posted May 24, 2026

Location Singapore, Singapore
Job Type Full-time
Category other-general
Posted May 24, 2026

Job Responsibilities

  • Lead and manage a wafer fab manufacturing engineering module specializing in Wet Etch and Electroplating processes
  • Manage and develop a team of engineers and technicians in a high‑volume manufacturing environment
  • Drive excellence in output, quality, cost, equipment uptime, and safety
  • Ensure robust process control, stability, and integration across wet etch and plating operations
  • Lead root‑cause investigations for process, quality, and equipment issues and drive permanent corrective actions
  • Drive yield improvement, scrap reduction, and defect reduction through data‑driven analysis
  • Ensure high equipment availability and reliability, particularly for wet benches and plating tools
  • Apply and sustain SPC and statistical analysis tools to monitor and improve process performance
  • Actively contribute to continuous improvement programs to resolve chronic manufacturing or quality iss...

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