Memory Packaging Technical Manager
Location
Hsinchu City, Taiwan Province
Job Type
Full-time
Category
Operations Specialties Managers
Posted
May 29, 2026
Job DescriptionProduct 2.5D/3D/3.5D heterogeneous package development, LPDDR/HBM/IPM development for advanced package, product memory roadmap, package memory architecture , customized HBM developmentRequirement1. >10yrs DRAM (LPDDR/HBM..) technical experience, RD is a plus. 2. Familiar with memory design, architecture, process, packaging, materials… 3. Project handling experience