NPI Engineer (FOL & Back-end)

Onsemi • Vietnam, Dong Nai, Vietnam • Posted June 08, 2026

Location Vietnam, Dong Nai

Job Type Full time

Category Engineers

Posted June 08, 2026

Job Summary: 
· Power module assembly process (End of Line: Mold, Trim/Form, CD/ED) Development. 

· Key person responsible to align processes between R&D and Manufacturing. 

· Establish process POR through set up, feasibility and characterization followed by package development procedure. 
Responsibilities
Involve in tooling design, new material exploration, new generation die technology characterization and new technology of assembly for semiconductor industry
Troubleshooting the issue during development stage with analytical and technical skill
Exploring new technology in the market and competitor movement.
Develop process flow for new package development in semiconductor
Qualifications & experience
Degree in Mechanical, Mechatronics Engineering, Electronic, Materials or relevant educational background. 
Minimum 5 years’ experienced in Semiconductor area
KNO...
            

Interested in this role?

Click the button below to start your application.
Apply Now