Packaging Module Development Engineer

INTEL • Arizona, Phoenix, United States • Posted June 28, 2026

Location Arizona, Phoenix

Job Type Permanent

Category Manufacturing Operations

Posted June 28, 2026

                Job Description 
The Role and Impact
Join Intel's Advanced Packaging Substrate Technology Development team as a Packaging Module Development Engineer and play a pivotal role in shaping the future of advanced packaging solutions. You will be at the forefront of developing cutting-edge assembly processes and equipment that enable Intel's roadmap for innovative assembly packaging technologies. In this role, you will contribute to optimizing manufacturing processes, improving product quality, reliability, and yield, while pushing the boundaries of technology to meet the demands of a rapidly evolving semiconductor industry. You will collaborate with cross-functional teams, explore innovative solutions, and drive breakthroughs in packaging technology that directly impact Intel's success in the global market.
This position is ideal for candidates who enjoy hands-on engineering work and are interested in developing as a Tool Owner and Process Owner within Intel...
            

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