Packaging Module Development Engineer

Intel • Phoenix, AZ, United States • Posted June 17, 2026

Location Phoenix, AZ
Job Type Full-time
Category other-general
Posted June 17, 2026
**Job Details:**

**Job Description:**
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing.
As a Packaging Module Development Engineer, you will.
• Contribute to the advancement of technology and foundry capabilities by developing First Level Interconnect (FLI) to support Intel's future packaging platforms.
• Collaborate with multifunctional, cross organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
• Drive innovation in next generation equipment, materials, and fabrication processes to scale advanced semiconductor packaging capabilities
• Lead equip...

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