Principal Engineer Advanced Package Technology Development

Micron Technology, Inc. • Boise, ID, United States • Posted June 03, 2026

Location Boise, ID
Job Type Full-time
Category other-general
Posted June 03, 2026
**Our vision is to transform how the world uses information to enrich life for** **_all_** **.**

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

**Job summary**

As a Principal Engineer within Micron’s Advanced Package Technology Development team, you will play a key role in driving innovation through strategic, industry‑informed leadership. Based at the Boise campus, you will shape advanced packaging technology roadmaps and investment priorities by applying deep technical expertise alongside rigorous cost and value analysis, enabling well‑balanced trade‑off decisions across performance, scalability, and total cost of ownership. Working in a highly collaborative, dynamic environment, you will influence solutions aligned with Micron’s business objectives, contributing directly to increased...

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