Principal Memory Design Engineer, HBM

Micron Technology, Inc. • Richardson, TX, United States • Posted June 06, 2026

Location Richardson, TX
Job Type Full-time
Category other-general
Posted June 06, 2026
**Our vision is to transform how the world uses information to enrich life for** **_all_** **.**

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a Principal Design Engineer, you will build the future of memory by architecting and delivering high‑performance DRAM circuit compositions for advanced technology nodes. In this highly visible technical leadership role, you’ll develop innovation across building, layout, verification, and silicon validation. You will collaborate closely with multi-functional teams to deliver scalable, manufacturable solutions for next-generation memory products. Your work will directly influence performance, power, reliability, and time‑to‑market for Micron’s groundbreaking memory technologies.

**Responsibilities**

+ Design and optimize DRAM circuits ...

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