Principal Packaging Engineer - SiC

ic resources • Hamburg, Hamburg, Germany • Posted May 30, 2026

Location Hamburg, Hamburg

Job Type Permanent

Category Engineers

Posted May 30, 2026

 Our international client is currently searching for a Principal Packaging Engineer to support all the business groups with SiC power packaging expertise. The role will involve leading the functionality and performance of SiC products and interfacing with the global package and assembly development community. An important part of the role will be supporting customer interaction, market trends and bench-marking for the company road maps.
 
 Required skills for the Principal Packaging Engineer will include:
 Extensive knowledge of semiconductor packages, assembly materials and assembly processes
 Strong SiC or GaN packaging knowledge
 Excellent communication skills and team player within global, intercultural environment
 University degree in Physics, Materials Technology, Electronics Engineering or similar
 Please contact Rachel Anderson for further details.

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