Process Engineer (Die bond)
Location
Telok Panglima Garang, Malaysia
Job Type
Full-time
Category
other-general
Posted
June 06, 2026
Process Engineer (Die bond)
Job Description
Assembly Process Engineering Team supports productions operations by resolving line issues and optimizing processes to meet Quality, Cost and Delivery target. The role also leads New Product Introduction (NPI), ensuring smooth transfer from design through qualification to mass production.
**Key Responsibilities**
+ Establish, optimize, and control manufacturing process conditions, including implementation of SPC and monitoring of key process indicators (yield, defect trends).
+ Lead New Product Introduction (NPI) activities from design transfer, process setup, qualification, sample builds, and ramp‑up to mass production.
+ Evaluate, qualify, and release new materials, equipment, and tooling in accordance with QMS requirements.
+ Troubleshoot process and equipment issues, control non‑conforming products, and implement corrective and preventive actions to prevent defect escape.
+ Drive yield impro...
Job Description
Assembly Process Engineering Team supports productions operations by resolving line issues and optimizing processes to meet Quality, Cost and Delivery target. The role also leads New Product Introduction (NPI), ensuring smooth transfer from design through qualification to mass production.
**Key Responsibilities**
+ Establish, optimize, and control manufacturing process conditions, including implementation of SPC and monitoring of key process indicators (yield, defect trends).
+ Lead New Product Introduction (NPI) activities from design transfer, process setup, qualification, sample builds, and ramp‑up to mass production.
+ Evaluate, qualify, and release new materials, equipment, and tooling in accordance with QMS requirements.
+ Troubleshoot process and equipment issues, control non‑conforming products, and implement corrective and preventive actions to prevent defect escape.
+ Drive yield impro...