Process Engineer: Semiconductor Packaging & Back‑End

Tampere University is looking to fill up to three Process Engineer roles at SiPFAB focused on next-generation semiconductor packaging. You will lead the development of key processes like flip-chip bonding and encapsulation. This role involves collaboration with academia and industry on innovative projects.

The ideal candidate will have a Master's or Ph.D. in a relevant field and at least three years of experience in semiconductor technologies. A hands-on approach and strong problem-solving skills are essential. A flexible work environment and competitive benefits are offered.