Process Engineering Wirebond

onsemi • Lapu-Lapu City, Philippines, Philippines • Posted June 03, 2026

Location Lapu-Lapu City, Philippines
Job Type Full-time
Category other-general
Posted June 03, 2026
Wire Bond Process Engineer optimizes, sustains, and develops ultrasonic wire bonding processes to enhance yield, quality, and cost-efficiency in semiconductor manufacturing. Key duties include managing New Product Introductions (NPI), conducting DoE (Design of Experiments) for process optimization, troubleshooting defects (bond lifts, wire breaks), and mentoring junior staff.

**onsemi** (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

**More details about our company benefits can be...

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