Senior Package Design Engineer

Micron Technology, Inc. • Boise, ID, United States • Posted June 17, 2026

Location Boise, ID
Job Type Full-time
Category other-general
Posted June 17, 2026
**Our vision is to transform how the world uses information to enrich life for** **_all_** **.**

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The Global Design, Simulation, and Substrate team at Micron Technology is a world-class group of engineers developing advanced semiconductor packaging solutions for memory products including DRAM and NAND. The team operates globally, collaborating with internal assembly sites, technology development teams, and external OSAT partners to deliver high-performance, reliable, and manufacturable package designs across Micron's product portfolio!

As a Senior Package Design Engineer, you will lead co-design activities that bridge silicon design, package architecture, and product development for advanced DRAM and memory products targeting applications su...

Interested in this role?

Click the button below to start your application.

Apply Now