Senior Packaging Process Integration Engineer (2.5D/3D)

Applied Materials South East Asia is seeking a skilled individual to develop advanced packaging technologies for semiconductor processes in Singapore. Candidates with at least 7 years of experience in semiconductor technology and a STEM degree will thrive in this full-time position. Responsibilities include managing wafers in cleanroom environments and employing data analysis for optimization, along with effective technical program management. This role offers a supportive work culture focused on professional growth.
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