SR ENGINEER, PACKAGE PRE STACKING
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Job Description
Advanced package technology (HBM product) research and development, experience with wafer thin wafer dicing techniques such as laser grooving, blade saw, Stealth dicing, laser full cut and plasma dicing, and wafer grinding.
Applies and engage advance dicing tool to complete process development.
Experience with dicing tape material evaluation for different dicing processes and key material properties.
Familiar with assembly and packaging processes such as hybrid bond, wafer mounting, wafer dicing, wafer thinning or grinding, et...