Staff IC Packaging Substrate Engineer (Korea or Taiwan)

Qualcomm • Hsinchu City, Hsinchu City, Taiwan • Posted June 21, 2026

Location Hsinchu City, Hsinchu City

Job Type FULL_TIME

Category Engineers

Posted June 21, 2026

Company:
Qualcomm Semiconductor Limited
Job Area:
Engineering Group, Engineering Group > Packaging EngineeringGeneral Summary:
Job Overview:
Qualcomm Packaging group is responsible for developing new package technologies and high-volume manufacturing deployment for different product segments for mobile market & new emerging markets for AI, IoT, Automotive. This team is responsible for roadmap, working with OSATs, IC substrate suppliers, internal design and product teams as well as NPI. Team is looking for experienced packaging substrate engineer who has worked on substrate technologies.
This IC package substrate engineering role will focus on 2D/2.5D based chiplet technology development and next-generation substrate technologies used in advanced semiconductor packaging. The role requires IC substrate fine patterning, small via, new material knowledge and data analysis skill set.
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