TBDB Research Engineer – Wafer-Level Packaging

A*STAR - Agency for Science, Technology and Research in Singapore is looking for a Research Engineer specializing in Wafer-to-Wafer Bonding. In this role, you will develop and optimize processes essential for advanced semiconductor packaging, especially with ultra-thin wafers. Candidates should have a Bachelor's degree in relevant fields and experience in TBDB process development is a plus. Strong analytical skills, problem-solving abilities, and teamwork are essential for success in this position.
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